| from | 28-06-202316:00 |
| until | 28-06-202317:00 |
| duration | 1 hour |
| place | Fraunhofer IIS/EAS |
| city | Dresden, Germany |
| name | Ms. Marie NoackFraunhofer IIS/EAS |
| Marie.Noack@eas.iis.fraunhofer.de |
Based on the state of the art of integration technologies, our webinar shows possible integration approaches for chiplet based multi die systems to build future sensor fusion platforms e.g. for ADAS and AGV application. Furthermore, we discuss current and future chip to chip standards and their advantages and disadvantages for automotive and AGV applications.